The abstract should be submitted as an attached file of the e-mail. At the same time, please tell us in which style you want to present your paper, ORAL or POSTER. The e-mail address is given below. This e-mail address is being protected from spambots. You need JavaScript enabled to view it

The format of ABSTRACT is referred to an example attached herewith.

• The person who has a plan to make a paper presentation in POLYCHAR-19 is requested to submit an ABSTRACT before October 30th, 2010.
• The manuscript should be prepared using a Microsoft WORD.
• Figures and Tables should be pasted in proper places of the abstract.
• The abstract should be written in only one sheet of A4-size page.
• The colors in figures may be reproduced in a CD, but they are printed in monochromatic color in an ABSTRACT booklet.

POLYCHAR19 – World Forum on Advanced Materials
March 20 - 24, 2011, Kathmandu, NEPAL

 

THE TITLE HERE (FONT: ARIAL, 10, BOLD, UPPERCASE AND CENTERED). THE TITLE MUST BE CLEAR AND CONVICT (LIMITED UP TO TWO LINES AND SINGLE PARAGRAPH).

Insert here author names separated with comma, (Font: Arial, 9, bold). Please underline the congress participant.
Jean Marc (Dr)*,  Second Author (xx)**, Third Author (xx)**
Insert here the authors data (company, address, e-mail for contacts) (Font: Arial, 9, itálic). Model:
* Calorimetry Lab. – University of …, Address:  Street, number, POBox, City, State, Country        
**Thermal Analysis Lab. – University of …, Address: …

E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it

Keywords: up to three keywords (max. length: 30 characters each)  (Font: Arial, 9, itálic).

TEXT (Font: Arial, 10).

Please, do not insert logos.

 

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References

Curtis, M. D.; Shiu, K.; Butler, W. M.; Huffmann, J. C. J. Am. Chem. Soc. 1986, 108, 3335.
2 Shiu, K.; Curtis, M. D.; Huffmann, J. C. J. Am. Chem. Soc. 1988, 118, 2014.

 

 

 

 

Submission preference :

oral

poster

or any

 

 

 

 

 

 

 

POLYCHAR19 – World Forum on Advanced Materials
March 20 - 24, 2011, Kathmandu, NEPAL